As the name implies, the thermal conductivity of the aluminum substrate is an aluminum substrate heat dissipation performance parameter. It is one of the three major standards for measuring the quality of the aluminum substrate (thermal resistance value and pressure resistance value are the other two properties). The thermal conductivity of the aluminum substrate can be measured after the plates are pressed
The data obtained from the test instrument test show that the current high thermal conductivity is generally ceramics, copper, etc., but due to cost considerations, most of the current market is aluminum substrates, and the corresponding aluminum substrate thermal conductivity is a parameter that everyone cares about , Heat conduction
A higher coefficient is one of the signs of better performance. Aluminum substrate is a unique metal-based copper clad aluminum substrate, which has good thermal conductivity, electrical insulation performance and mechanical processing performance.
In general, in LED design and various electronic designs, there will be applications of aluminum substrates, and LED heat dissipation design is based on fluid dynamics software for simulation and basic design, which is very important for the production of aluminum substrates. necessary.
The so-called resistance of fluid flow is due to the viscosity of the fluid and the influence of the solid boundary, which results in the fluid being subjected to a certain resistance during the flow process. This resistance is called flow resistance, which can be divided into two kinds of resistance along the way and local resistance;
Cheng resistance is a region where the boundary changes rapidly, such as a sudden enlargement or abrupt reduction of the cross-section, elbows and other local positions. It is the flow resistance caused by a sudden change in the flow state of the fluid.
Generally, the heat sink used in the LED aluminum substrate is natural heat dissipation, which is mainly divided into three steps in the design process of the heat sink:
1. Design the outline of the radiator according to the relevant constraints;
2. Optimize the tooth thickness, tooth shape, tooth spacing and aluminum substrate thickness of the radiator according to the relevant design criteria of the aluminum substrate radiator;
3. Perform check calculations to ensure the heat dissipation performance of the radiator.
