1 The power density of the module, the thermal conductivity of the aluminum substrate needs to be better, and the thermal resistance is low
2 The current carrying capacity is large, and the thickness of the conductive layer (copper) of the aluminum substrate should be increased accordingly
3 The insulation breakdown voltage of the aluminum alloy plate and the electrical insulation performance requirements of the module
4 A minimum insulation barrier must be maintained between the edge of the circuit board (a hole or circuit board) and the nearest conductor, generally the material thickness is ± 0.5mm
5Aluminum plate stamping, drilling, cutting and other processing techniques, careful insulation of the aluminum substrate layer without damaging or polluting close to the conductor
6 With the rapid development of the electronics industry, the requirements for completing the flatness of the PCB board are getting higher and higher, bending, twisting and smooth punching, the quality of aluminum-based PCB structure and cutting and other processing tools, and due to the circuit layer, Between the insulating thermal conductive layer and the metal layers with different expansion coefficients. The aluminum substrate is affected by the conductive layer. The thickness ratio of the effect (copper) to the primary metal (aluminum), the greater the ratio, the greater the curvature. If the copper foil thickness is less than 10% of the base of the metal thickness, the base metal (aluminum) will dominate the mechanical properties. If the thickness of the copper foil exceeds 10% of the thickness of the metal substrate to form the PCB is satisfactory, the structure will be PCB bending
7 Because of the difference in the circuit layer (copper) and the expansion coefficient of the base metal, the aluminum substrate and the aluminum-based PCB board are bent to a certain extent. The bending depends on the number and the width of the copper remaining on the PCB. If the wire is narrow enough, the expansion coefficient caused by the stress disappears in the insulating and thermally conductive layer.
